TESCAN GROUP introduces the MIRA XR, an ultra-high-resolution SEM-EDS solution designed for fast, precise materials analysis in academic research and quality control environments.

Designed to bridge the gap between conventional FEG SEMs and ultra-high-resolution (UHR) systems, MIRA XR offers analytical flexibility, ease of use, and streamlined workflows for both industrial and research applications.

Precision, Speed, and Versatility for Industry & Research

MIRA XR is engineered for high-throughput environments, including quality control, metallurgy, battery research, and semiconductor failure analysis, where both speed and imaging accuracy are critical.

A New Balance Between Resolution and Usability

“With MIRA XR, we’ve created a solution optimized for demanding users seeking advanced imaging performance combined with ease of operation,” said Jean-Charles Chen, TESCAN GROUP CEO. “Our customers now have a SEM that delivers resolution at nanoscale, productivity and analytical versatility for multi-user environment.”

“We listened to customer feedback and designed a system that optimizes every step of the workflow. Introducing MIRA XR, featuring MIRA-optimized BrightBeam™ technology for exceptional low-keV imaging performance, with a focus on minimizing time to data. MIRA XR allows operators to focus on their samples, rather than instrument adjustments, ensuring a faster, more seamless path to high-resolution insights,” adds Bruno Janssens, Chief Strategy Officer of TESCAN GROUP.

Key Advantages of MIRA XR:

High-Speed, High-Resolution Imaging – BrightBeam™ technology achieves sub-nanometer resolution at low accelerating voltages, while Wide Field Optics™ speeds up sample navigation by 40%.

• Optimized Analytical Workflow – Dual Essence™ EDS reduces elemental analysis turnaround by up to 50%.
• Flexible Sample Handling – MultiVac™ mode enables low-vacuum operation for beam-sensitive and outgassing samples.
• Automated and User-Friendly – In-Flight™ Automation simplifies imaging, making high-resolution imaging accessible to all experience levels.

Launch Webinars & Product Demonstrations

To showcase MIRA XR’s capabilities, TESCAN Group has scheduled a series of events and webinar for industry and academia.

Webinar:

• 22.05.2025 - Follow-up Webinar MIRA XR solutions for Battery Industry, registration.

Microscopy congresses:

• 24.06.2025 - MMC in Manchaster, United Kingdom
• 27.07.2025 - M&M in Salt Lake CIty, Utah, United States
• 31.08.2025 - MC in Karlsruhe, Germany

View Product Information

About TESCAN GROUP

TESCAN was established in 1991 and has grown from a 5 engineers start-up initially, to a company with 800 employees working in 11 countries. We are a leading player in charged-particle optical instrumentation, including Scanning and Scanning Transmission Electron Microscopy (SEM & STEM), Focused Ion Beam (FIB) and X-ray Computed Tomography (micro-CT), with nearly 4500 instruments sold and operational in more than 80 countries.

In 2013, it expanded by merging with ORSAY PHYSICS, a French global leader in customized focused ion and electron beam technologies, and in 2018 by acquiring XRE, a Belgian innovator in the field of Dynamic and micro-CT technologies. A further, more recent milestone was the acquisition in 2023 of TESCAN ORSAY HOLDING and all its subsidiaries by CARLYLE, a US private equity company. In 2024, TESCAN Group successfully acquired the business of EXpressLO LLC through an asset deal, including its patents. Other significant milestones in 2024 included the acquisition of TESCAN KOREA, Ltd. (TKL) and Daeil Microanalysis Laboratory (DML), as well as the announcement of the establishment of new subsidiaries: TESCAN Taiwan and TESCAN Singapore. TESCAN GROUP is headquartered in Brno, Czech Republic, where most of our instruments are expertly assembled, tested, and shipped to customers across the globe.